Electronic device with heat dissipation apparatus

ABSTRACT

A heat dissipation apparatus includes a shaped and resilient connecting plate, and a first heat-dissipating plate and a second heat-dissipating plate clamping down on a storage device to dissipate heat.

BACKGROUND

1. Technical Field

The present disclosure relates to electronic devices and, particularly,to an electronic device with a heat dissipation apparatus.

2. Description of Related Art

Electronic components, such as memory cards, and solid state disks(SSDs), generate a large amount of heat during operation. It isnecessary to cool the SSDs to maintain safe operating conditions andassure the proper and reliable functioning of the SSDs. A fan maygenerate a cooling airflow, but as the loads increase and the operatingspeeds of the devices using the electronic components increase, heatdissipation using only airflow may be insufficient for the amount ofheat generated.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with referenceto the drawings. The components in the drawings are not necessarilydrawn to scale, the emphasis instead being placed upon clearlyillustrating the principles of the embodiments. Moreover, in thedrawings, like reference numerals designate corresponding partsthroughout the several views.

FIG. 1 is an exploded, isometric view of a first exemplary embodiment ofan electronic device, wherein the electronic device includes a heatdissipation apparatus.

FIG. 2 is an enlarged and cutaway view of the heat dissipation apparatusof FIG. 1.

FIG. 3 is an assembled, isometric view of the heat dissipation apparatusof FIG. 1.

FIG. 4 is a sectional view of the heat dissipation apparatus in FIG. 3,taken along the line of IV-IV.

FIG. 5 is a sectional view of a second exemplary embodiment of anelectronic device.

DETAILED DESCRIPTION

The present disclosure, including the accompanying drawings, isillustrated by way of examples and not by way of limitation. It shouldbe noted that references to “an” or “one” embodiment in this disclosureare not necessarily to the same embodiment, and such references mean atleast one.

Referring to FIG. 1, a first embodiment of an electronic device includesa motherboard 400, a storage device 200 positioned on the motherboard400, and a heat dissipation apparatus 100.

The storage device 200 includes a plurality of components 202 mounted onboth sides of the storage device 200. The storage device 200 is parallelto and spaced away from the motherboard 400. In the embodiment, thestorage device 200 is a solid state disk (SSD).

Referring to FIG. 2, the heat dissipation apparatus 100 includes aresilient connecting plate 104 with a V-shaped cross-section andcomprising a first distal side 104 a and a second distal side 104 bopposite to the first distal side 104 a, and a first heat-dissipatingplate 102 and a second heat-dissipating plate 103 slantingly extendingfrom the first and second distal sides 104 a and 104 b toward eachother. The structure of the plate 104 connecting with the first andsecond heat-dissipating plates 102 and 103 resembles M-shaped in crosssection. The connecting plate 104, and the first and secondheat-dissipating plates 102 and 103 cooperatively bound a receivingspace 106. The inner surfaces of the first and second heat-dissipatingplates 102 and 103 each define a plurality of receiving slots 107. Adistal end of the first heat-dissipating plate 102 opposite to theconnecting plate 104 defines a cutout 108, for access and manipulationpurposes. In the embodiment, the heat dissipation apparatus 100 may bemade of a resilient and heat-dissipating material, such as steel oraluminum, and is configured to resiliently endure some deformation.

Referring to FIGS. 3-4, in assembly of the heat dissipation apparatus100 to the storage device 200, the first and second heat-dissipatingplates 102 and 103 can be pulled away from each other, by fingerpressure through the cutout 108. The second heat-dissipating plate 103is below the storage device 200. Therefore, the storage device 200 fitsinto the receiving space 106. After the components 202 are aligned withthe receiving slots 107, the first and second heat-dissipating plates102 and 103 are released. The first and second heat-dissipating plates102 and 103 self-restore to clamp between them the storage device 200.The components 202 are received in the receiving slots 107 to preventthe heat dissipation apparatus 100 from disengaging from the storagedevice 200, and, being electrically isolated as necessary, make contactwith each of the components 202 to facilitate the transfer of heat intothe heat dissipation apparatus 100.

In use, any amount of heat generated by the components 202 istransferred to the heat dissipation apparatus 100 to provide a largesurface area for the immediate and rapid dissipation of heat.

Referring to FIG. 5, a second embodiment of an electronic device issubstantially similar to the first embodiment of the electronic device,except that a heat dissipation apparatus 100 a includes a firstheat-dissipating plate 102 a, a second heat-dissipating plate 103 a, anda flexible guiding plate 30 mounted on each inner surface of the firstand second heat-dissipating plates 102 a and 103 a. The guiding plates30 can be deformed to clamp different types of storage devices ofdifferent thicknesses. Any amount of heat generated is transferred tothe heat dissipation apparatus 100 a through the guiding plates 30.

While the disclosure describes examples and embodiments, it is to beunderstood that the disclosure is not limited thereto. On the contrary,the disclosure is intended to cover various modifications and similararrangements as would be apparent to those skilled in the art.Therefore, the scope of the appended claims should be accorded thebroadest interpretation so as to encompass all such modifications andsimilar arrangements.

What is claimed is:
 1. A heat dissipation apparatus for cooling astorage device, comprising: a resilient connecting plate with a V-shapedcross-section and comprising a first distal side and a second distalside; a first heat-dissipating plate slantingly extending from a firstdistal side of the connecting plate; and a second heat-dissipating plateslantingly extending from a second distal side of the connecting platetoward the first heat-dissipating plate, to clamp the storage devicetogether with the first heat-dissipating plate.
 2. The heat dissipationapparatus of claim 1, wherein inner surfaces of the first and secondheat-dissipating plates each define a plurality of receiving slots forreceiving a plurality of components of the storage device.
 3. The heatdissipation apparatus of claim 1, further comprising two flexibleguiding plates mounted on inner surfaces of the first and secondheat-dissipating plates, to clamp the storage device.
 4. The heatdissipation apparatus of claim 1, wherein the heat dissipation apparatusis made of resilient heat-dissipation material.
 5. An electronic devicecomprising: a motherboard; a storage device positioned on themotherboard, and comprising a plurality of components mounted to twoopposite sides of the storage device; and a heat dissipation apparatuscomprising a V-shaped resilient connecting plate with two oppositedistal sides, and a first heat-dissipating plate and a secondheat-dissipating plate slantingly extending from the two opposite distalsides of the connecting plate toward each other, to clamp the storagedevice.
 6. The electronic device of claim 5, wherein inner surfaces ofthe first and second heat-dissipating plates each define a plurality ofreceiving slots for receiving the corresponding components of thestorage device.
 7. The electronic device of claim 5, wherein the heatdissipation apparatus further comprises two flexible guiding platesmounted on inner sides of the first and second heat-dissipating plates,to clamp the storage device.
 8. The electronic device of claim 5,wherein the heat dissipation apparatus is made of resilientheat-dissipation material.
 9. The electronic device of claim 5, whereinthe storage device is a solid state disk.